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1、CPU&3DNow!（3D no waiting，无须等待的3D处理）&AAM（AMD Analyst Meeting，AMD分析家会议）&ABP（Advanced Branch Prediction，高级分支预测）&ACG（Aggressive Clock Gating，主动时钟选择）&AIS（Alternate Instruction Set，交替指令集）&ALAT（advanced load table，高级载入表）&ALU（Arithmetic Logic Unit，算术逻辑单元）&Aluminum（铝）&AGU（Address Generation Units，地址产成单元）&APC（Advanced Power Control，高级能源控制）&APIC（Advanced rogrammable Interrupt Controller，高级可编程中断控制器）&APS（Alternate Phase Shifting，交替相位跳转）&ASB（Advanced System Buffering，高级系统缓冲）&ATC（Advanced Transfer Cache，高级转移缓存）&ATD（Assembly Technology Development，装配技术发展）&BBUL（Bumpless Build-Up Layer，内建非凹凸层）&BGA（Ball Grid Array，球状网阵排列）&BHT（branch prediction table，分支预测表）&Bops（Billion Operations Per Second，10亿操作/秒）&BPU（Branch Processing Unit，分支处理单元）&BP（Brach Pediction，分支预测）&BSP（Boot Strap Processor，启动捆绑处理器）&BTAC（Branch Target Address Calculator，分支目标寻址计算器）&CBGA (Ceramic Ball Grid Array，陶瓷球状网阵排列)&CDIP (Ceramic Dual-In-Line，陶瓷双重直线)&Center Processing Unit Utilization，中央处理器占用率&CFM（cubic feet per minute，立方英尺/秒）&CMT（course-grained multithreading，过程消除多线程）&CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）&CMOV（conditional move instruction，条件移动指令）&CISC（Complex Instruction Set Computing，复杂指令集计算机）&CLK（Clock Cycle，时钟周期）&CMP（on-chip multiprocessor，片内多重处理）&CMS（Code Morphing Software，代码变形软件）&co-CPU（cooperative CPU，协处理器）&COB（Cache on board，板上集成缓存，做在CPU卡上的二级缓存，通常是内核的一半速度&））&COD（Cache on Die，芯片内核集成缓存）&Copper（铜）&CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列）&CPI（cycles per instruction，周期/指令）&CPLD（Complex Programmable Logic Device，複雜可程式化邏輯元件）&CPU（Center Processing Unit，中央处理器）&CRT（Cooperative Redundant Threads，协同多余线程）&CSP（Chip Scale Package，芯片比例封装）&CXT（Chooper eXTend，增强形K6-2内核，即K6-3）&Data Forwarding（数据前送）&dB（decibel，分贝）&DCLK（Dot Clock，点时钟）&DCT（DRAM Controller，DRAM控制器）&DDT（Dynamic Deferred Transaction，动态延期处理）&Decode（指令解码）&DIB（Dual Independent Bus，双重独立总线）&DMT（Dynamic Multithreading Architecture，动态多线程结构）&DP（Dual Processor，双处理器）&DSM（Dedicated Stack Manager，专门堆栈管理）&DSMT（Dynamic Simultaneous Multithreading，动态同步多线程）&DST（Depleted Substrate Transistor，衰竭型底层晶体管）&DTV（Dual Threshold Voltage，双重极限电压）&DUV（Deep Ultra-Violet，纵深紫外光）&EBGA（Enhanced Ball Grid Array，增强形球状网阵排列）&EBL（electron beam lithography，电子束平版印刷）&EC（Embedded Controller，嵌入式控制器）&EDEC（Early Decode，早期解码）&Embedded Chips（嵌入式）&EPA（edge pin array，边缘针脚阵列）&EPF（Embedded Processor Forum，嵌入式处理器论坛）&EPL（electron projection lithography，电子发射平版印刷）&EPM（Enhanced Power Management，增强形能源管理）&EPIC（explicitly parallel instruction code，并行指令代码）&EUV（Extreme Ultra Violet，紫外光）&EUV（extreme ultraviolet lithography，极端紫外平版印刷）&FADD（Floationg Point Addition，浮点加）&FBGA（Fine-Pitch Ball Grid Array，精细倾斜球状网阵排列）&FBGA（flipchip BGA，轻型芯片BGA）&FC-BGA（Flip-Chip Ball Grid Array，反转芯片球形栅格阵列）&FC-LGA（Flip-Chip Land Grid Array，反转接点栅格阵列）&FC-PGA（Flip-Chip Pin Grid Array，反转芯片针脚栅格阵列）&FDIV（Floationg Point Divide，浮点除）&FEMMS：Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态&FFT（fast Fourier transform，快速热欧姆转换）&FGM（Fine-Grained Multithreading，高级多线程）&FID（FID：Frequency identify，频率鉴别号码）&FIFO（First Input First Output，先入先出队列）&FISC（Fast Instruction Set Computer，快速指令集计算机）&flip-chip（芯片反转）&FLOPs（Floating Point Operations Per Second，浮点操作/秒）&FMT（fine-grained multithreading，纯消除多线程）&FMUL（Floationg Point Multiplication，浮点乘）&FPRs（floating-point registers，浮点寄存器）&FPU（Float Point Unit，浮点运算单元）&FSUB（Floationg Point Subtraction，浮点减）&GFD（Gold finger Device，金手指超频设备）&GHC（Global History Counter，通用历史计数器）&GTL（Gunning Transceiver Logic，射电收发逻辑电路）&GVPP（Generic Visual Perception Processor，常规视觉处理器）&HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状网阵封装&HTT（Hyper-Threading Technology，超级线程技术）&Hz（hertz，赫兹，频率单位）&IA（Intel Architecture，英特尔架构）&IAA（Intel Application Accelerator，英特尔应用程序加速器）&ICU（Instruction Control Unit，指令控制单元）&ID（identify，鉴别号码）&IDF（Intel Developer Forum，英特尔开发者论坛）&IEU（Integer Execution Units，整数执行单元）&IHS（Integrated Heat Spreader，完整热量扩展）&ILP（Instruction Level Parallelism，指令级平行运算）&IMM: Intel Mobile Module, 英特尔移动模块&Instructions Cache，指令缓存&Instruction Coloring（指令分类）&IOPs（Integer Operations Per Second，整数操作/秒）&IPC（Instructions Per Clock Cycle，指令/时钟周期）&ISA（instruction set architecture，指令集架构）&ISD（inbuilt speed-throttling device，内藏速度控制设备）&ITC（Instruction Trace Cache，指令追踪缓存）&ITRS（International Technology Roadmap for Semiconductors，国际半导体技术发展蓝&图）&KNI（Katmai New Instructions，Katmai新指令集，即SSE）&Latency（潜伏期）&LDT（Lightning Data Transport，闪电数据传输总线）&LFU（Legacy Function Unit，传统功能单元）&LGA（land grid array，接点栅格阵列）&LN2（Liquid Nitrogen，液氮）&Local Interconnect（局域互连）&MAC（multiply-accumulate，累积乘法）&mBGA (Micro Ball Grid Array，微型球状网阵排列)&nm（namometer，十亿分之一米/毫微米）&MCA（machine check architecture，机器检查体系）&MCU（Micro-Controller Unit，微控制器单元）&MCT（Memory Controller，内存控制器）&MESI（Modified, Exclusive, Shared, Invalid：修改、排除、共享、废弃）&MF（MicroOps Fusion，微指令合并）&mm（micron metric，微米）&MMX（MultiMedia Extensions，多媒体扩展指令集）&MMU（Multimedia Unit，多媒体单元）&MMU（Memory Management Unit，内存管理单元）&MN（model numbers，型号数字）&MFLOPS（Million Floationg Point/Second，每秒百万个浮点操作）&MHz（megahertz，兆赫）&mil（PCB 或晶片佈局的長度單位，1 mil = 千分之一英寸）&MIPS（Million Instruction Per Second，百万条指令/秒）&MOESI（Modified, Owned, Exclusive, Shared or Invalid，修改、自有、排除、共享或&无效）&MOF（Micro Ops Fusion，微操作熔合）&Mops（Million Operations Per Second，百万次操作/秒）&MP（Multi-Processing，多重处理器架构）&MPF（Micro processor Forum，微处理器论坛）&MPU（Microprocessor Unit，微处理器）&MPS（MultiProcessor Specification，多重处理器规范）&MSRs（Model-Specific Registers，特别模块寄存器）&MSV（Multiprocessor Specification Version，多处理器规范版本）&NAOC（no-account OverClock，无效超频）&NI（Non－Intel，非英特尔）&NOP（no operation，非操作指令）&NRE（Non-Recurring Engineering charge，非重複性工程費用）&OBGA（Organic Ball Grid Arral，有机球状网阵排列）&OCPL（Off Center Parting Line，远离中心部分线队列）&OLGA（Organic Land Grid Array，有机平面网阵包装）&OoO（Out of Order，乱序执行）&OPC（Optical Proximity Correction，光学临近修正）&OPGA（Organic Pin Grid Array，有机塑料针型栅格阵列）&OPN（Ordering Part Number，分类零件号码）&PAT（Performance Acceleration Technology，性能加速技术）&PBGA（Plastic Pin Ball Grid Array，塑胶球状网阵排列）&PDIP (Plastic Dual-In-Line，塑料双重直线)&PDP（Parallel Data Processing，并行数据处理）&PGA（Pin-Grid Array，引脚网格阵列）,耗电大&PLCC (Plastic Leaded Chip Carriers，塑料行间芯片运载)&Post-RISC（加速RISC，或后RISC）&PR（Performance Rate，性能比率）&PIB（Processor In a Box，盒装处理器）&PM（Pseudo-Multithreading，假多线程）&PPGA（Plastic Pin Grid Array，塑胶针状网阵封装）&PQFP（Plastic Quad Flat Package，塑料方块平面封装）&PSN（Processor Serial numbers，处理器序列号）&QFP（Quad Flat Package，方块平面封装）&QSPS（Quick Start Power State，快速启动能源状态）&RAS（Return Address Stack，返回地址堆栈）&RAW（Read after Write，写后读）&REE（Rapid Execution Engine，快速执行引擎）&Register Contention（抢占寄存器）&Register Pressure（寄存器不足）&Register Renaming（寄存器重命名）&Remark（芯片频率重标识）&Resource contention（资源冲突）&Retirement（指令引退）&RISC（Reduced Instruction Set Computing，精简指令集计算机）&ROB（Re-Order Buffer，重排序缓冲区）&RSE（register stack engine，寄存器堆栈引擎）&RTL（Register Transfer Level，暫存器轉換層。硬體描述語言的一種描述層次）&SC242（242-contact slot connector，242脚金手指插槽连接器）&SE（Special Embedded，特别嵌入式）&SEC（Single Edge Connector，单边连接器）&SECC（Single Edge Contact Cartridge，单边接触卡盒）&SEPP（Single Edge Processor Package，单边处理器封装）&Shallow-trench isolation（浅槽隔离）&SIMD（Single Instruction Multiple Data，单指令多数据流）&SiO2F（Fluorided Silicon Oxide，二氧氟化硅）&SMI（System Management Interrupt，系统管理中断）&SMM（System Management Mode，系统管理模式）&SMP（Symmetric Multi-Processing，对称式多重处理架构）&SMT（Simultaneous multithreading，同步多线程）&SOI（Silicon-on-insulator，绝缘体硅片）&SOIC (Plastic Small Outline，塑料小型)&SONC（System on a chip，系统集成芯片）&SPGA（Staggered Pin Grid Array、交错式针状网阵封装）&SPEC（System Performance Evaluation Corporation，系统性能评估测试）&SQRT（Square Root Calculations，平方根计算）&SRQ（System Request Queue，系统请求队列）&SSE（Streaming SIMD Extensions，单一指令多数据流扩展）&SFF（Small Form Factor，更小外形格局）&SS（Special Sizing，特殊缩放）&SSP（Slipstream processing，滑流处理）&SST（Special Sizing Techniques，特殊筛分技术）&SSOP (Shrink Plastic Small Outline，缩短塑料小型)&STC（Space Time Computing，空余时间计算）&Superscalar（超标量体系结构）&TAP（Test Access Port，测试存取端口）&TBGA（Tie Ball Grid Array，带状球形光栅阵列）&TCP: Tape Carrier Package（薄膜封装）,发热小&TDP（Thermal Design Power，热量设计功率）&Throughput（吞吐量）&TLB（Translate Look side Buffers，转换旁视缓冲器）&TLP（Thread-Level Parallelism，线程级并行）&TMP（Threaded Multi-Path，线程多通道）&TPI（True Performance Initiative/index，真实性能为先/指标）&TQFP (Thin Plastic Quad Flat Pack，薄型方面平面封装)&Trc（Row Cycle Time，列循环时间）&TrD（Transistor Density，晶体管密度）&TSOP（Thin Small Outline Plastic，薄型小型塑料）&USWC（Uncacheabled Speculative Write Combination，无缓冲随机联合写操作）&VALU（Vector Arithmetic Logic Unit，向量算术逻辑单元）&VFSD（Vertex Frequency Stream Divider，顶点频率流分隔）&VID（VID：Voltage identify，电压鉴别号码）&VLIW（Very Long Instruction Word，超长指令字）&VPU（Vector Permutate Unit，向量排列单元）&VPU（vector processing units，向量处理单元，即处理MMX、SSE等SIMD指令的地方）&VSA（Virtual System Architecture，虚拟系统架构）&VTF（VIA Technical Forum，威盛技术论坛）&XBar（Crossbar，交叉口闩仲载逻辑单元）&XP（Experience，体验）&XP（Extra performance，额外性能）&XP（eXtreme Performance，极速性能）&散热器&TFT（Tiny Fin Technology，微型鳍片技术）&2、主板&3GIO（Third Generation Input/Output，第三代输入输出技术）&ACR（Advanced Communications Riser，高级通讯升级卡）&ADIMM（advanced Dual In-line Memory Modules，高级双重内嵌式内存模块）&AGTL+（Assisted Gunning Transceiver Logic，援助发射接收逻辑电路）&AHCI（Advanced Host Controller Interface，高级主机控制器接口）&AIMM（AGP Inline Memory Module，AGP板上内存升级模块）&AMR（Audio／Modem Riser；音效／调制解调器主机板附加直立插卡）&AHA（Accelerated Hub Architecture，加速中心架构）&AOI（Automatic Optical Inspection，自动光学检验）&APU（Audio Processing Unit，音频处理单元）&ARF（Asynchronous Receive FIFO，异步接收先入先出）&ASF（Alert Standards Forum，警告标准讨论）&ASK IR（Amplitude Shift Keyed Infra-Red，长波形可移动输入红外线）&AT（Advanced Technology，先进技术）&ATX（AT Extend，扩展型AT）&BIOS（Basic Input/Output System，基本输入/输出系统）&CNR（Communication and Networking Riser，通讯和网络升级卡）&CSA（Communication Streaming Architecture，通讯流架构）&CSE（Configuration Space Enable，可分配空间）&COAST（Cache-on-a-stick，条状缓存）&DASP（Dynamic Adaptive Speculative Pre-Processor，动态适应预测预处理器）&DB: Device Bay，设备插架&DMI（Desktop Management Interface，桌面管理接口）&DOT（Dynamic Overclocking Technonlogy，动态超频技术）&DPP（direct print Protocol，直接打印协议&DRCG（Direct Rambus clock generator，直接RAMBUS时钟发生器）&DVMT（Dynamic Video Memory Technology，动态视频内存技术）&E（Economy，经济，或Entry-level，入门级）&EB（Expansion Bus，扩展总线）&EFI（Extensible Firmware Interface，扩展固件接口）&EHCI（Enhanced Host Controller Interface，加强型主机端控制接口）&EISA（Enhanced Industry Standard Architecture，增强形工业标准架构）&EMI（Electromagnetic Interference，电磁干扰）&ESCD（Extended System Configuration Data，可扩展系统配置数据）&ESR（Equivalent Series Resistance，等价系列电阻）&FBC（Frame Buffer Cache，帧缓冲缓存）&FireWire（火线，即IEEE1394标准）&FlexATX（Flexibility ATX，可扩展性ATX）&FSB（Front Side Bus，前端总线）&FWH（Firmware Hub，固件中心）&GB（Garibaldi架构，Garibaldi基于ATX架构，但是也能够使用WTX构架的机箱）&GMCH（Graphics & Memory Controller Hub，图形和内存控制中心）&GPA（Graphics Performance Accelerator，图形性能加速卡）&GPIs（General Purpose Inputs，普通操作输入）&GTL+（Gunning Transceiver Logic，发射接收逻辑电路）&HDIT（High Bandwidth Differential Interconnect Technology，高带宽微分互连技术）&HSLB（High Speed Link Bus，高速链路总线）&HT（HyperTransport，超级传输）&I2C（Inter-IC）&I2C（Inter-Integrated Circuit，内置集成电路）&IA（Instantly Available，即时可用）&IBASES（Intel Baseline AGP System Evaluation Suite，英特尔基线AGP系统评估套件）&IC（integrate circuit，集成电路）&ICH（Input/Output Controller Hub，输入/输出控制中心）&ICH-S（ICH-Hance Rapids，ICH高速型）&ICP（Integrated Communications Processor，整合型通讯处理器）&IHA（Intel Hub Architecture，英特尔Hub架构）&IMB（Inter Module Bus，隐藏模块总线）&INTIN（Interrupt Inputs，中断输入）&IPMAT（Intel Power Management Analysis Tool，英特尔能源管理分析工具）&IR（infrared ray，红外线）&IrDA（infrared ray，红外线通信接口，可进行局域网存取和文件共享）&ISA（Industry Standard Architecture，工业标准架构）&ISA（instruction set architecture，工业设置架构）&K8HTB（K8 HyperTransport Bridge，K8闪电传输桥）&LSI（Large Scale Integration，大规模集成电路）&LPC（Low Pin Count，少针脚型接口）&MAC（Media Access Controller，媒体存储控制器）&MBA（manage boot agent，管理启动代理）&MC（Memory Controller，内存控制器）&MCA（Micro Channel Architecture，微通道架构）&MCH（Memory Controller Hub，内存控制中心）&MDC（Mobile Daughter Card，移动式子卡）&MII（Media Independent Interface，媒体独立接口）&MIO（Media I/O，媒体输入/输出单元）&MOSFET（metallic oxide semiconductor field effecttransistor，金属氧化物半导体场&效应晶体管）&MRH-R（Memory Repeater Hub，内存数据处理中心）&MRH-S（SDRAM Repeater Hub，SDRAM数据处理中心）&MRIMM（Media-RIMM，媒体RIMM扩展槽）&MSI（Message Signaled Interrupt，信息信号中断）&MSPCE(Multiple Streams with Pipelining and Concurrent Execution，多重数据流的流&水线式传输与并发执行）&MT=MegaTransfers（兆传输率）&MTH（Memory Transfer Hub，内存转换中心）&MuTIOL（Multi-Threaded I/O link，多线程I/O链路）&NCQ（Native Command Qu，本地命令序列）&NGIO（Next Generation Input/Output，新一代输入/输出标准）&NPPA（nForce Platform Processor Architecture，nForce平台处理架构）&OHCI（Open Host Controller Interface，开放式主控制器接口）&ORB（operation request block，操作请求块）&ORS（Over Reflow Soldering，再流回焊接，SMT元件的焊接方式）&P64H（64-bit PCI Controller Hub，64位PCI控制中心）&PCB（printed circuit board，印刷电路板）&PCBA（Printed Circuit Board Assembly，印刷电路板装配）&PCI（Peripheral Component Interconnect，互连外围设备）&PCI SIG（Peripheral Component Interconnect Special Interest Group，互连外围设备&专业组）&PDD（Performance Driven Design，性能驱动设计）&PHY（Port Physical Layer，端口物理层）&POST（Power On Self Test，加电自测试）&PS/2（Personal System 2，第二代个人系统）&PTH（Plated-Through-Hole technology，镀通孔技术）&RE（Read Enable，可读取）&QP（Quad-Pumped，四倍泵）&RBB（Rapid BIOS Boot，快速BIOS启动）&RNG（Random number Generator，随机数字发生器）&RTC（Real Time Clock，实时时钟）&KBC（KeyBroad Control，键盘控制器）&SAP（Sideband Address Port，边带寻址端口）&SBA（Side Band Addressing，边带寻址）&SBC（single board computer，单板计算机）&SBP-2（serial bus protocol 2，第二代串行总线协协）&SCI（Serial Communications Interface，串行通讯接口）&SCK (CMOS clock，CMOS时钟)&SDU（segment data unit，分段数据单元）&SFF（Small Form Factor，小尺寸架构）&SFS（Stepless Frequency Selection，步进频率选项）&SMA（Share Memory Architecture，共享内存结构）&SMT（Surface Mounted Technology，表面黏贴式封装）&SPI（Serial Peripheral Interface，串行外围设备接口）&SSLL（Single Stream with Low Latency，低延迟的单独数据流传输）&STD（Suspend To Disk，磁盘唤醒）&STR（Suspend To RAM，内存唤醒）&SVR（Switching Voltage Regulator，交换式电压调节）&THT（Through Hole Technology，插入式封装技术）&UCHI（Universal Host Controller Interface，通用宿主控制器接口）&UPA（Universal Platform Architecture，统一平台架构）&UPDG（Universal Platform Design Guide，统一平台设计导刊）&USART（Universal Synchronous Asynchronous Receiver Transmitter，通用同步非同步&接收传送器）&USB（Universal Serial Bus，通用串行总线）&USDM（Unified System Diagnostic Manager，统一系统监测管理器）&VID（Voltage Identification Definition，电压识别认证）&VLB（Video Electronics Standards Association Local Bus，视频电子标准协会局域总&线）&VLSI（Very Large Scale Integration，超大规模集成电路）&VMAP（VIA Modular Architecture Platforms，VIA模块架构平台）&VSB（V Standby，待命电压）&VXB（Virtual Extended Bus，虚拟扩展总线）&VRM（Voltage Regulator Module，电压调整模块）&WCT（Wireless Connect Technology，无线连接技术）&WE（Write Enalbe，可写入）&WS（Wave Soldering，波峰焊接，THT元件的焊接方式）&XT（Extended Technology，扩充技术）&ZIF（Zero Insertion Force, 零插力插座）&芯片组&ACPI（Advanced Configuration and Power Interface，先进设置和电源管理）&AGP（Accelerated Graphics Port，图形加速接口）&BMS（Blue Magic Slot，蓝色魔法槽）&I/O（Input/Output，输入/输出）&MIOC: Memory and I/O Bridge Controller，内存和I/O桥控制器&NBC: North Bridge Chip（北桥芯片）&PIIX: PCI ISA/IDE Accelerator（加速器）&PSE36: Page Size Extension 36－bit，36位页面尺寸扩展模式&PXB: PCI Expander Bridge，PCI增强桥&RCG: RAS/CAS Generator，RAS/CAS发生器&SBC: South Bridge Chip（南桥芯片）&SMB（System Management Bus，全系统管理总线）&SPD（Serial Presence Detect，连续存在检测装置）&SSB: Super South Bridge，超级南桥芯片&TDP: Triton Data Path（数据路径）&TSC: Triton System Controller（系统控制器）&QPA: Quad Port Acceleration（四接口加速）&主板技术&Gigabyte&ACOPS: Automatic CPU OverHeat Prevention System（CPU过热预防系统）&SIV: System Information Viewer（系统信息观察）&磐英&ESDJ（Easy Setting Dual Jumper，简化CPU双重跳线法）&浩鑫&UPT（USB、PANEL、LINK、TV-OUT四重接口）&华硕&C.O.P（CPU overheating protection，处理器过热保护）&3、显示设备&AD（Analog to Digitalg，模拟到数字转换）&ADC（Apple Display Connector，苹果专用显示器接口）&AGC（Anti Glare Coatings，防眩光涂层）&AMR（ATi Multi-Rendering technology，ATi多重渲染技术）&ASIC（Application Specific Integrated Circuit，特殊应用积体电路）&ASC（Auto-Sizing and Centering，自动调效屏幕尺寸和中心位置）&ASC（Anti Static Coatings，防静电涂层）&ASD（Auto Stereoscopic Display，自动立体显示）&AG（Aperture Grills，栅条式金属板）&ARC（Anti Reflect Coating，防反射涂层）&BLA: Bearn Landing Area（电子束落区）&BMC（Black Matrix Screen，超黑矩阵屏幕）&CCS（Cross Capacitance Sensing，交叉电容感应）&cd/m^2（candela/平方米，亮度的单位）&CDRS（Curved Directional Reflection Screen，曲线方向反射屏幕）&CG-Silicon（Continuous Grain Silicon，连续微粒硅）&CNT（carbon nano-tube，碳微管）&CRC（Cyclical Redundancy Check，循环冗余检查）&CRT（Cathode Ray Tube，阴极射线管）&CVS（Compute Visual Syndrome，计算机视觉综合症）&DA（Digital to Analog，数字到模拟转换）&DDC（Display Data Channel，显示数据通道）&DDWG（Digital Display Working Group，数字化显示工作组）&DEC（Direct Etching Coatings，表面蚀刻涂层）&Deflection Coil（偏转线圈）&DFL（Dynamic Focus Lens，动态聚焦）&DFP（Digital Flat Panel，数字平面显示标准）&DFPG（Digital Flat Panel Group，数字平面显示标准工作组）&DFS（Digital Flex Scan，数字伸缩扫描）&DIC: Digital Image Control（数字图像控制）&Digital Multiscan II（数字式智能多频追踪）&DLP（digital Light Processing，数字光处理）&DMD（Digital Micromirror Device，数字微镜设备）&DOSD: Digital On Screen Display（同屏数字化显示）&DPMS（Display Power Management Signalling，显示能源管理信号）&Dot Pitch（点距）&DQL（Dynamic Quadrapole Lens，动态四极镜）&DSP（Digital Signal Processing，数字信号处理）&DSTN（Double layers Super Twisted Nematic，双层超扭曲向列，无源矩阵LCD）&DTV（Digital TV，数字电视）&DVI（Digital Visual Interface，数字化视像接口）&ECD（ElectroChromic Display，电铬显示器）&EFEAL（Extended Field Elliptical Aperture Lens，可扩展扫描椭圆孔镜头）&EL（Electro Luminescence，电镀发光体）&FED（Field Emission Displays，电场发射式显示器）&Flyback Transformer（回转变压器）&FPD（flat panel display，平面显示器）&FRC: Frame Rate Control（帧比率控制）&FSTN（Film Super Twisted Nematic，薄膜超扭曲向列）&GLV（grating-light-valve，光栅亮度阀）&HDMI（High Definition Multimedia Interface，高精度多媒体接口）&HDTV（high definition television，高清晰度电视）&HVD（High Voltage Differential，高分差动）&IFT（Infinite FlatTube，无限平面管，三星丹娜）&INVAR（不胀铜）&IPS（in-plane switching，平面开关）&LCD（liquid crystal display，液晶显示屏）&LCOS: Liquid Crystal On Silicon（硅上液晶）&LED（light emitting diode，光学二级管）&L-SAGIC（Low Power-Small Aperture G1 wiht Impregnated Cathode，低电压光圈阴极管&）&LTPS（Low-Temperature Poly-Si，低温多晶硅）&LVD（Low Voltage Differential，低分差动）&LVDS（Low Voltage Differential Signal，低分差动信号）&LRTC（LCD Response Time Compensation，液晶响应时间补偿）&LTPS（Low Temperature Polysilicon，低温多硅显示器）&MALS（Multi Astigmatism Lens System，多重散光聚焦系统）&MDA（Monochrome Adapter，单色设备）&Monochrome Monitor（单色显示器）&MS: Magnetic Sensors（磁场感应器）&MVA（multi-domain vertical alignment，广域垂直液晶队列）&OEL（organic electro-luminescent，有机电镀冷光）&OLED（Organic light-emitting diode，有机电激发光显示器）&OSD（On Screen Display，同屏显示）&PAC（psycho-acoustic compensation，心理声学补偿）&P&D（Plug and Display，即插即显）&PDP（Plasma Display Panel，等离子显示器）&Porous Tungsten（活性钨）&PPI（Pixel Per Inch，像素／英寸）&RGB（Red、Blue、Green，红、蓝、绿三原色）&ROP（raster operations，光栅操作）&RSDS: Reduced Swing Differential Signal（小幅度摆动差动信号）&SC（Screen Coatings，屏幕涂层）&Single Ended（单终结）&Shadow Mask（点状阴罩）&SXGA（Super eXtended Graphics Array，超级扩展型图形阵列）&STN（Super Twisted Nematic，超扭曲向列，无源矩阵）&TCO（The Swedish Confederation of Professional Employees，瑞典专业工作人员联合&会）&TDT（Timeing Detection Table，数据测定表）&TMDS（Transition Minimized Differential Signaling，转换极低损耗微分信号）&TN（Twisted Nematic，扭曲液晶向列，无源矩阵LCD）&TN+film（twisted nematic and retardation film，扭曲液晶向列+延迟薄膜）&TICRG: Tungsten Impregnated Cathode Ray Gun（钨传输阴级射线枪）&TFT（thin film transistor，薄膜晶体管，有源矩阵LCD）&Trinitron（特丽珑）&TSTN（triple supertwisted nematic，三倍超扭曲向列）&UCC（Ultra Clear Coatings，超清晰涂层）&UFB（Ultra-Fine&Bright，新概念超亮度液晶显示屏）&UXGA (Ultra Extended Graphics Array，极速扩展图形阵列）&VAGP: Variable Aperature Grille Pitch（可变间距光栅）&VBI: Vertical Blanking Interval（垂直空白间隙）&VESA（Video Electronics Standards Association，视频电子标准协会）&VGA（video graphics array，视频图像阵列）&VDT（Video Display Terminals，视频显示终端）&VFD（Vacuum Fluorescent Display，真空荧光显示器）&VRR: Vertical Refresh Rate（垂直扫描频率）&VW（Virtual Window，虚拟视窗）&XGA（eXtended Graphics Array，扩展型图形阵列）&YUV（亮度和色差信号）&4、视频&3D：Three Dimensional，三维&3DCG（3D computer graphics，三维计算机图形）&3DS（3D SubSystem，三维子系统）&A-Buffer（Accumulation Buffer，积聚缓冲）&AA（Accuview Antialiasing，高精度抗锯齿）&ADC（Analog to Digital Converter，模数传换器）&ADI（Adaptive De-Interlacing，自适应交错化技术）&AE（Atmospheric Effects，大气雾化效果）&AFC（Advanced Frame Capture、高级画面捕获）&AFR（Alternate Frame Rendering，交替渲染技术）&Anisotropic Filtering（各向异性过滤）&APPE（Advanced Packet Parsing Engine，增强形帧解析引擎）&AR（Auto-Resume，自动恢复）&AST（amorphous-silicon TFT，非晶硅薄膜晶体管）&AV（Analog Video，模拟视频）&AV（Audio & Video，音频和视频）&B Splines（B样条）&BAC（Bad Angle Case，边角损坏采样）&Back Buffer，后置缓冲&Backface culling（隐面消除）&Battle for Eyeballs（眼球大战，各3D图形芯片公司为了争夺用户而作的竞争）&Bilinear Filtering（双线性过滤）&B.O.D.E（Body、Object、Design、Envioment，人体、物体、设计、环境渲染自动识别）&BSP（Binary Space Partitioning，二进制空间分区）&CBMC（Crossbar based memory controller，内存控制交叉装置）&CBU（color blending unit，色彩混和单位）&CEA（Critical Edge Angles，临界边角）&CEM（cube environment mapping，立方环境映射）&CG（C for Graphics/GPU，用于图形/GPU的可编程语言）&CG（Computer Graphics，计算机生成图像）&Clipping（剪贴纹理）&Clock Synthesizer，时钟合成器&compressed textures（压缩纹理）&Concurrent Command Engine，协作命令引擎&CSC（Colorspace Conversion，色彩空间转换）&CSG (constructive solid geometry，建设立体几何）&CSS（Content Scrambling System，内容不规则加密）&DAC（Digital to Analog Converter，数模传换器）&DCD（Directional Correlational De-interlacing，方向关联解交错）&DCT（Display Compression Technology，显示压缩技术）&DCT（Display Compatibility Test，显示设备兼容性测试）&DDC（Dynamic Depth Cueing，动态深度暗示）图像&DDP（Digital Display Port，数字输出端口）&DDS（Direct Draw Surface，直接绘画表面）&Decal（印花法，用于生成一些半透明效果，如：鲜血飞溅的场面）&DFP（Digital Flat Panel，数字式平面显示器）&DFS: Dynamic Flat Shading（动态平面描影）,可用作加速&Dithering（抖动）&Directional Light，方向性光源&DM（Displacement mapping，位移贴图）&DME（Direct Memory Execute，直接内存执行）&DOF（Depth of Field，多重境深）&dot texture blending（点型纹理混和）&DOT3（Dot product 3 bump mapping，点乘积凹凸映射）&Double Buffering（双缓冲区）&DPBM（Dot Product Bump Mapping，点乘积凹凸映射）&DQUICK（DVD Qualification and Integration Kit，DVD资格和综合工具包）&DRA（deferred rendering architecture，延迟渲染架构）&DRI（Direct Rendering Infrastructure，基层直接渲染）&DSP（Dual Streams Processor，双重流处理器）&DVC（Digital Vibrance Control，数字振动控制）&DVI（Digital Video Interface，数字视频接口）&DVMT（Dynamic Video Memory Technology，动态视频内存技术）&DxR: DynamicXTended Resolution（动态可扩展分辨率）&DXTC（Direct X Texture Compress，DirectX纹理压缩，以S3TC为基础）&Dynamic Z-buffering（动态Z轴缓冲区）,显示物体远近,可用作远景&E-DDC（Enhanced Display Data Channel，增强形视频数据通道协议，定义了显示输出与&主系统之间的通讯通道，能提高显示输出的画面质量）&Edge Anti－aliasing（边缘抗锯齿失真）&E-EDID（Enhanced Extended Identification Data，增强形扩充身份辨识数据，定义了电&脑通讯视频主系统的数据格式）&eFB（embedded Frame Buffer，嵌入式帧缓冲）&eTM（embedded Texture Buffer，嵌入式纹理缓冲）&Execute Buffers，执行缓冲区&Embosing，浮雕&EMBM（environment mapped bump mapping，环境凹凸映射）&Extended Burst Transactions，增强式突发处理&Factor Alpha Blending（因子阿尔法混合）&Fast Z-clear，快速Z缓冲清除&FB（fragment buffer，片段缓冲）&FL（fragment list，片段列表）&FW（Fast Write，快写，AGP总线的特殊功能）&Front Buffer，前置缓冲&Flat（平面描影）&FL（Function Lookup，功能查找）&FMC（Frictionless Memory Control，无阻内存控制）&Frames rate is King（帧数为王）&FRC（Frame Rate Control，帧率控制）&FSAA（Full Scene/Screen Anti－aliasing，全景/屏幕抗锯齿）&Fog（雾化效果）&flip double buffered（反转双缓存）&fog table quality（雾化表画质）&F-Buffer（Fragment Stream FIFO Buffer，片段流先入先出缓冲区）&GPT（Graphics Performance Toolkit，图形性能工具包）&FRJS（Fully Random Jittered Super-Sampling，完全随机移动式超级采样）&Fur（软毛效果）&GART（Graphic Address Remappng Table，图形地址重绘表）&GI（Global Illumination，球形光照）&GIC（Gold Immersion Coating，化金涂布技术，纯金材质作为PCB最终层，提升信号完整&性）&GIF（Graphics Interchange Format，图像交换格式）&Gouraud Shading，高洛德描影，也称为内插法均匀涂色&GPU（Graphics Processing Unit，图形处理器）&GTF（Generalized Timing Formula，一般程序时间，定义了产生画面所需要的时间，包括&了诸如画面刷新率等）&GTS（Giga Textel Sharder，十亿像素填充率）&Guard Band Support（支持保护带）&HAL（Hardware Abstraction Layer，硬件抽像化层）&HDR（High Dynamic Range，高级动态范围）&HDRL（high dynamic-range lighting，高动态范围光线）&HDVP（High-Definition Video Processor，高精度视频处理器）&HEL: Hardware Emulation Layer（硬件模拟层）&HLSL（High Level Shading Language，高级描影语言）&HMC（hardware motion compensation，硬件运动补偿）&Hierarchical Z（Z分级）&high triangle count（复杂三角形计数）&HOS（Higher-Order Surfaces，高次序表面）&HPDR（High-Precision Dynamic-Range，高精度动态范围）&HRAA（High Resolution Anti－aliasing，高分辨率抗锯齿）&HSI（High Speed Interconnect，高速内连）&HSR（Hidden Surface Removal，隐藏表面移除）&HTP（Hyper Texel Pipeline，超级像素管道）&HWMC（Hardware Motion Compensation，硬件运动补偿）&ICD（Installable Client Driver，可安装客户端驱动程序）&iDCT（inverse Discrete Cosine Transformation，负离散余弦转换）&IDE（Integrated Development Environment，集成开发环境）&Immediate Mode，直接模式&IMMT（Intelligent Memory Manager Technology，智能内存管理技术）&Imposters（诈欺模型）&IPEAK GPT（Intel Performance Evaluation and Analysis Kit - Graphics Performanc&e Toolkit，英特尔性能评估和分析套件 - 图形性能工具包）&IPPR: Image Processing and Pattern Recognition（图像处理和模式识别）&IR（Immediate Rendering，直接渲染）&IRA（immediate-mode rendering architecture，即时渲染架构）&IQ（inverse quantization，反转量子化）&ITC（Internal True Color，内部真彩色）&IVC（Indexed Vertex Cache，索引顶点缓存）&JFAA（Jitter Free Anti Aliasing，自由跳跃进抗锯齿）&JGSS（Jittered Grid Super-Sampling，移动式栅格超级采样）&JPRS（Jittered pseudo random sampling，抖动假取样）&Key Frame Interpolation，关键帧插补&large textures（大型纹理）&LE（low end，低端）&LF（Linear Filtering，线性过滤，即双线性过滤）&LFB（Linear Frame-Buffer，线性帧缓冲）&LFM（Light Field Mapping，光照区域贴图）&lighting（光源）&lightmap（光线映射）&LMA（Lightspeed memory Architecture，光速内存架构）&Local Peripheral Bus（局域边缘总线）&LOD（Levels-of-Detail，细节级）&Lossless Z Compression，无损Z压缩&LPF（Low-past filter，低通道滤波器）&LSR（Light Shaft Rendering，光线轴渲染）&mipmapping（MIP映射）&MAC（Mediocre Angle Case，普通角采样）&Matrix Vertex Blending，矩阵顶点混和&MCM（Multichip Module，多芯片模块）&Membrane lighting，隔膜光线&Mipmap LOD Bias Adjustment（映射LOD偏移调节）&Modulate（调制混合）&Motion Compensation，动态补偿&motion blur（模糊移动）&MPPS：Million Pixels Per Second，百万个像素/秒&MRT（Multiple Render Targets，多重渲染目标）&MSAA（multisampling Scene/Screen Anti－aliasing，多重采样抗锯齿）&Multiplicative Texture Blending（乘法纹理混合）&Multi-Resolution Mesh，多重分辨率组合&Multi Threaded Bus Master，多线程主控&Multitexture（多重纹理）&MVSD（Motion Vector Steered de-interlacing，移动向量控制解交错）&MXM（Mobile PCI Express Module，移动PCI Express模块）&NURBS（Non Uniform Relational B Splines，非统一相关B样条）&nerest Mipmap（邻近MIP映射，又叫点采样技术）&NGP（Next-Generation Graphics Port，下一代图形接口）&NSR（nVidia Shading Rasterizer，nVidia描影光栅引擎）&NXL（NVIDIA XPress Link，nViadia X紧迫链路）&OGSS（Ordered Grid Super-Sampling，顺序栅格超级采样）&ORB（Online ResultBrowser，在线分数浏览）&OTES（Outside Thermal Exhaust System，向外热排气系统）&Overdraw（透支，全景渲染造成的浪费）&partial texture downloads（并行纹理传输）&Parallel Processing Perspective Engine（平行透视处理器）&PC（pipeline combining，管道结合）&Perspective Correction（透视纠正）&Perspective Divide，透视分隔&PGC（Parallel Graphics Configuration，并行图像设置）&PureHAL（Pure Hardware Abstraction Layer，纯硬件处理层）&PIP（Picture In Picture，画中画）&pixel（Picture element，图像元素，又称P像素，屏幕上的像素点）&PM（parallax mapping，视差映射）&Point Primitive Support（支持原始点）&point light（一般点光源）&point sampling（点采样技术，又叫邻近MIP映射）&Point Sprit（点碎片纹理）&Positional Lights（定点光源）&Precise Pixel Interpolation，精确像素插值&precomputed/preimaged（预计算/预描绘）&Procedural textures（可编程纹理）&Projected Textrues（投射纹理）&PS（Pixel Shaders，像素描影）&PT（Projective textures，投影纹理）&PTC（Palletized Texture Compression，并行纹理压缩）&PVA（Patterned Vertical Alignment，图像垂直调整）&PVPU（Programable Vertex Processing Unit，可编程顶点处理单元）&QC（Quad Cache，四重缓存）&QDR（Quad Data Rate，四倍速率）&QDR SDRAM（Quad Data Rate，四倍速率 SDRAM）&RAMDAC（Random Access Memory Digital to Analog Converter，随机存储器数/模转换器&）&Range Fog（延伸雾化）&PB（Priority buffer，优先缓冲）&PJSS（programmable jitter table，可编程抖动表）&ps（picoseconds，皮秒，微微秒，百亿分之一秒）&Reflection mapping（反射贴图）&render（着色或渲染）&Rendering to a Window（窗口透视）&RGBA（Red、Blue、Green + Alpha，红、蓝、绿 + Alpha通道）&RGSS（Rotated Grid Super-Sampling，旋转栅格超级采样）&RM（Retention Mechanism，保持机构）&RSAA（Random Sampling Anti aliasing，随机采样抗锯齿）&RTV（Real Time Video，实时视频）&S端子（Seperate）&S3（Sight、Sound、Speed，视频、音频、速度）&S3TC（S3 Texture Compress，S3纹理压缩，以前仅支持S3显卡）&S3TL（S3 Transformation & Lighting，S3多边形转换和光源处理）&SB（Shadow Buffer，描影缓冲）&Screen Buffer（屏幕缓冲）&SDTV（Standard Definition Television，标准清晰度电视）&SEM（spherical environment mapping，球形环境映射）&SGCT（self-gauging clock technology，自测量时钟技术）&Shading，描影&SIF2（SUMA Individual Analog Filter 2，SUMA独立模拟过滤器2）&Single Pass Multi-Texturing，单通道多纹理&SLAM（Symmetrically Loaded Acoustic Module，平衡装载声学模块）&SLI（Scanline Interleave，扫描线间插，3Dfx的双Voodoo 2配合技术）&SLI（Scalable Link Interface，可延展连接界面，nVidia的GeForce6800双显卡技术）&Smart Filter（智能过滤）&soft shadows（柔和阴影）&soft reflections（柔和反射）&spot light（小型点光源）&SRA（Symmetric Rendering Architecture，对称渲染架构）&Specular Gouraud Shading（镜面高洛德描影）&SS（Smart Shader，智能描影）&SSAA（Super-Sampling Anti－aliasing，超级采样抗锯齿）&Stencil Buffers（模板缓冲）&Stream Processor（流线处理）&Subpixel Accurate Rasterizing（区块子像素精确光栅化）&Subtractive Texture Blending（反纹理混合）&Super Sampling（超级采样）&SuperScaler Rendering，超标量渲染&Table Fog（雾化函数表）&TBFB（Tile Based Frame Buffer，碎片纹理帧缓存）&TBR（Tile Based rendering，瓦片纹理渲染）&tessellation（镶嵌）&texel（T像素，纹理上的像素点）&Texture Alpha Blending（纹理Alpha混合）&Texture Clamping（纹理箝入）&Texture Fidelity（纹理真实性）&Texture Mirroring（纹理反射）&texture swapping（纹理交换）&Texture Wrapping（纹理外包）&T&L（Transform and Lighting，多边形转换与光源处理）&T-Buffer（T缓冲，3dfx Voodoo5的特效，包括全景反锯齿Full-scene Anti-Aliasing、动&态模糊Motion Blur、焦点模糊Depth of Field Blur、柔和阴影Soft Shadows、柔和反射&Soft Reflections）&TCA（Twin Cache Architecture，双缓存结构）&TIFF（Tagged Image File Format，标签图像文件格式）&Triangle Setup，三角形设置&Transparency（透明状效果）&Transformation（三角形转换）&Trilinear Filtering（三线性过滤）&Texture Modes，材质模式&TMIPM: Trilinear MIP Mapping（三次线性MIP材质贴图）&TMU（Texture Map Unit，纹理映射单元）&UCA（Unified Compiler Architecture，统一编译架构）&UDA（Unified Driver Architecture，统一驱动程序架构）&UDOT（UltraSharp Display Output Technology，超清晰显示输出技术）&UMA（Unified Memory Architecture，统一内存架构）&UMA（Unified Motherboard Architecture，统一主板架构）&UPT（unreal performance test，虚幻引擎性能测试）&VA（Vernier Acuity，视敏度）&VDM（Virtual Displacement Mapping，虚拟位移映射）&Visualize Geometry Engine，可视化几何引擎&Vertex Alpha Blending（顶点Alpha混合）&Vertex Fog（顶点雾化）&Vertex Lighting（顶点光源）&Vertical Interpolation（垂直调变）&Viewport Transform，视点转换&VIP（Video Interface Port，视频接口）&VIVO（video input/output，视频输入/输出）&ViRGE: Video and Rendering Graphics Engine（视频描写图形引擎）&VMR（Video Mixing Renderer，视频混合渲染器）&VMS（Virtual Memory System，虚拟内存系统）&VOC（Visual Online Communication，视觉在线通讯）&Voxel（Volume pixels，立体像素，Novalogic的技术）&VP（vertex processors，顶点处理器）&VPE（Video Processing Engine，视频处理引擎）&VPU（Vertex Processing Unit，顶点处理单元）&VPU（Visual Processing Unit，视觉处理单元）&VQTC（Vector-Quantization Texture Compression，向量纹理压缩）&VS（Vertex Shaders，顶点描影）&VS（Visibility Subsystem，可见子系统）&VSA（Voodoo Scalable Architecture，可升级Voodoo架构）&VSU（Vertex/Scalability Unit，顶点/可量测性单元）&VSIS（Video Signal Standard，视频信号标准）&VSync（Vertical Sync，重直同步刷新）&VT（Volume textures，体积纹理）&VT（Vertex Texturing，顶点纹理绘制）&VTC（Volume Texture Compression，体积纹理压缩）&W-Fog（W雾化）&Xabre（&Sabre&（基础）＋eXtraordinary（非凡）＋Advanced（先进）＋Brilliant（&卓越）＋Rapture（欢喜）＋Enrichment（丰富））&XBA（Xtreme Bandwidth Architecture，极速带宽架构）&YAB NCTC（Narrow Channel Texture compression，狭窄通道纹理压缩）&Z Buffer（Z缓存）&ZRT（Zone Rendering Technology，区域渲染技术）&ZOC（Z-Occlusion Culling，Z闭塞选择）&5、音频&3DPA（3D Positional Audio，3D定位音频）&AAC（Advanced Audio Compression，高级音频压缩）&AC（Acoustic Edge，声学边缘）&AC（Audio Codec，音频多媒体数字信号编解码器）&AC-3（Audio Coding 3，第三代音响编码）&AC97（Audio Codec '97，多媒体数字信号解编码器1997年标准）&ACIRC（Advanced Cross Interleave Reed - Solomon Code，高级交叉插入里德所罗门代&码）&ADIP（ADdress In Pre-groove，地址预刻）&AFC（Amplitude-frequency characteristic，振幅频率特征）&AMC（audio/modem codec，音频/调制解调器多媒体数字信号编解码器）&APS（Audio Production Studio，音频生产工作室）&APX（All Position eXpansion全方位扩展）&ASIO（Audio Streaming Input and Output interface，音频流输入输出接口）&ATRAC（Adaptive TRansform Acoustic Coding，可适应转换声学译码，MD专用数字声音数&据压缩系统）&AUD_EXT（Audio Extension，音频扩展）&AUX（Auxiliary Input，辅助输入接口）&CBR（Constant Bit Rate，固定比特率）&CS（Channel Separation，声道分离）&CMSS（Creative Multi Speaker Surround，创新多音箱环绕）&CPRM（Content Protection for recordable media，记录媒体内容保护）&DAB（digital audio broadcast，数字音频广播）&DBBS（Dynamic Bass Boost System，动态低音增强系统）&DCC（Digital Compact Cassette，数字盒式磁带）&DDMA（Distributed DMA，分布式DMA）&DDSS（Dolby Digital Surround Sound，杜比数字环绕声）&DHT（Dolby Headphone Technology，杜比耳机技术）&DLS（Downloadable Sounds Level，可下载音色）&DLS-2（Downloadable Sounds Level 2，第二代可下载音色）&DS3D（DirectSound 3D Streams）&DSD（Direct Stream Digital，直接数字信号流）&DSL（Down Loadable Sample，可下载的取样音色）&DSO（Dynamic Sound-stage Organizer，动态声音层组建）&DSP（Digital Sound Field Processing，数字音场处理）&DTS（Digital Theater System，数字剧院系统）&DTT（DeskTop Theater，桌面剧院）&EAX（Environmental Audio Extensions，环境音效扩展技术）&EFM (Eight to Fourteen Modulation，8位信号转换为14位信号)&ESP（Electronic-Shock Protection，电子抗震系统）&Extended Stereo（扩展式立体声）&FM（Frequency Modulation，频率调制）&FIR（finite impulse response，有限推进响应）&FLAC（Free Lossless Audio Codec，自由无损音频解编码）&FPS（FourPointSurround，创新的四点环绕扬声器系统）&FR（Frequence Response，频率响应）&FSE（Frequency Shifter Effect，频率转换效果）&GM（General Midi，普通MIDI）&HDA（high-efficiency Audax High Definition Aerogel，高效高清楚气动）&Hi-fi（high fidelity，高精度设备）&HPF（High-Pass Filter，高通滤波器）&HRTF（Head Related Transfer Function，头部关联传输功能）&I3DL2（Interactive 3D Level 2，第二级交互式3D音效）&IID（Interaural Intensity Difference，两侧声音强度差别）&IIR（infinite impulse response，无限推进响应）&Interactive Around-Sound（交互式环绕声）&Interactive 3D Audio（交互式3D音效）&ITD（Interaural Time Difference，两侧声音时间延迟差别）&LFE（Low Frequency Sound Channel，低频声音通道）&LP（Long Play，长时间播放）&LPF（Low-Pass Filter，低通滤波器）&MC（modem codec，调制解调器多媒体数字信号编解码器）&MDLP（MiniDisc Long Play，长时间播放迷你光盘）&MFM（Magnetic field modulation，磁场调制）&MIDI（Musical Instrument Digital Interface，乐器数字接口）&NC（Noise Canceling，降噪）&NDA: non-DWORD-aligned ，非DWORD排列&NVH（Noise、Vibration、Harshness，噪声、振动和刺耳声）&QEM（Qsound Environmental Modeling，Qsound环境建模扬声器组）&QMSS（QSound Multi Speaker System，Qsound多音箱系统）&Raw PCM: Raw Pulse Code Modulated（元脉码调制）&RMA: RealMedia Architecture（实媒体架构）&RMAA（Right Mark Audio Analyzer，公正标识音频分析软件）&RTSP: Real Time Streaming Protocol（实时流协议）&SACD（Super Audio CD，超级音乐CD）&SCMS（Serial Copy Management System，连续复制管理系统，限制数字拷贝）&SDMI（Secure Digital Music Initiative，安全式数字音乐）&SNR（Signal to Noise Ratio，信噪比）&S/PDIF（Sony/Phillips Digital Interface，索尼/飞利普数字接口）&SP（Stream Processor，音频流处理器）&SPU（Sound Processor Unit，声音处理器）&SPX（Sound Production Experience，声音生成体验）&SPX（Sound Production eXtensions，声音生成扩展）&SRC（Sampling Rate Convertor，采样率转换器，把48KHz转为MD适用的44.1KHz）&SRS（Sound Retrieval System，声音修复系统）&Surround Sound（环绕立体声）&Super Intelligent Sound ASIC（超级智能音频集成电路）&TAD（Telephone Answering Device，电话应答设备）&TC（Time Scaling，时间缩放）&TDMA（Transparent DMA，透明DMA）&THD+N（Total Harmonic Distortion plus Noise，总谐波失真加噪音）&TOC (Table Of Contents，MD内容表，包括磁盘名称、轨数、演奏时间）&VPT（Virtual Phone Technology C Acoustic Engine，虚拟耳机音效技术音响动力引擎）&TVA（Time Variable Amplitude，可随时间变化的音量）&TVF（Time Variable Filter，可随时间变化的滤波器）&UDAC-MB（universal distribution with access control-media base，通用分配存取控&制媒体基准）&UTOC (User Table of Contents，可录式MD内容表)&VBR（Variable Bit Rate，动态比特率）&WG（Wave Guide，波导合成）&WT（Wave Table，波表合成）&6、RAM & ROM&ABB（Advanced Boot Block，高级启动块）&ABP: Address Bit Permuting，地址位序列改变&ADT（Advanced DRAM Technology，先进DRAM技术联盟）&AL（Additive Latency，附加反应时间）&ALDC（Adaptive Lossless Data Compression，适应无损数据压缩）&APM（Automated Precision Manufacturing，自动化精确生产）&ATC（Access Time from Clock，时钟存取时间）&ATP（Active to Precharge，激活到预充电）&BEDO（Burst Enhanced Data-Out RAM，突发型数据增强输出内存）&BPA（Bit Packing Architecture，位封包架构）&AFC media（antiferromagnetically coupled media，反铁磁性耦合介质）&BLP（Bottom Leaded Package，底部导向封装）&BSRAM（Burst pipelined synchronous static RAM，突发式管道同步静态存储器）&CAS（Column Address Strobe，列地址控制器）&CCT（Clock Cycle Time，时钟周期）&CDRAM（Cache DRAM，附加缓存型DRAM）&CL（CAS Latency，CAS反应时间）&CMR（Colossal Magnetoresistive，巨磁阻抗）&CPA（Close Page Autoprecharge，接近页自动预充电）&CSP（Chip Size Package，芯片尺寸封装）&CTR（CAS to RAS，列地址到行地址延迟时间）&DB: Deep Buffer（深度缓冲）&DD（Double Side，双面内存）&DDBGA（Die Dimension Ball Grid Array，内核密度球状矩阵排列）&DDR（Double Date Rate，上下行双数据率）&DDR SDRAM（Double Date Rate，上下行双数据率SDRAM）&DRCG（Direct Rambus Clock Generator，直接RAMBUS时钟发生器）&DIL（dual-in-line）&DIVA（Data IntensiVe Architecture，数据加强架构）&DIMM（Dual In-line Memory Modules，双重内嵌式内存模块）&DLL（Delay－Locked Loop，延时锁定循环电路）&DQS（Bidirectional data strobe，双向数据滤波）&DRAM（Dynamic Random Access Memory，动态随机存储器）&DRDRAM（Direct RAMBUS DRAM，直接内存总线DRAM）&DRSL（Direct RAMBUS Signaling Level，直接RAMBUS信号级）&DRSL（Differential Rambus Signaling Levels，微分RAMBUS信号级）&DSM（Distributed shared memory，分布式共享内存）&ECC（Error Checking and Correction，错误检查修正）&ED（Execution driven，执行驱动）&EDO（Enhanced Data-Out RAM，数据增强输出内存）&EHSDRAM（Enhanced High Speed DRAM，增强型超高速内存）&EL DDR（Enhanced Latency DDR，增强反应周期DDR内存）&EMS（Enhanced Memory System，增强内存系统）&EMS（Expanded Memory Specification，扩充内存规格）&EOL（End of Life，最终完成产品）&EPROM（erasable, programmable ROM，可擦写可编程ROM）&EPOC（Elevated Package Over CSP，CSP架空封装）&EPV（Extended Voltage Proteciton，扩展电压保护）&ESDRAM（Enhanced SDRAM，增强型SDRAM）&ESRAM（Enhanced SRAM，增强型SRAM）&EEPROM（Electrically Erasable Programmable ROM，电擦写可编程只读存储器）&FCRAM（Fast Cycle RAM，快周期随机存储器）&FEMMA（Foldable Electronic Memory Module Assembly，折叠电子内存模块装配）&FM（Flash Memory，快闪存储器）&FMD ROM （Fluorescent Material Read Only Memory，荧光质只读存储器）&FPM（Fast Page Mode，快页模式内存）&HDSS（ Holographic Data Storage System，全息数据存储系统）&HMC（holographic media card，全息媒体卡）&HMD（holographic media disk，全息媒体磁盘）&HSDRAM（High Speed DRAM，超高速内存）&LRU（least recently used，最少最近使用）&MADP（Memory Address Data Path，内存地址数据路径）&MDRAM（Multi Bank Random Access Memory，多储蓄库随机存储器）&MRAM（Magnetic Random Access Memory，磁性随机存取存储器）&ns（nanosecond，纳秒，毫微秒，10亿分之一秒）&NVRAM（Non-Volatile RAM，非可变性RAM）&NWX（no write transfer，非写转换）&ODR（Octal Data Rate，八倍数据率）&ODT（on-die termination，片内终结器）&OP（Open Page，开放页）&PIROM：Processor Information ROM，处理器信息ROM&PLEDM: Phase-state Low Electron（hole）-number Drive Memory&PLL（Phase Lock Loop，相位锁定环）&PRISM（Photorefractive Information Storage Material，摄影折射信息存储原料）&PROM（Programmable Read Only Memory，可编程只读存储器）&PTA（Precharge to Active，预充电到激活）&QBM（Quad Band Memory，四倍边带内存）&QRSL（Quad Rambus Signaling Levels，四倍RAMBUS信号级）&RAC（Rambus Asic Cell，Rambus集成电路单元）&RAC（Row Access Time，行存取时间）&RAM（Random Access Memory，随机存储器）&RAS（Row Address Strobe，行地址控制器）&RAT（Precharge to Active Trp，预充电到激活时间）&RCD（Row to Cas Delay，行地址到列地址控制器延迟时间）&RDF（Rambus Developer Forum，RAMBUS发展商论坛）&RDRAM（Rambus Direct RAM，直接型RambusRAM）&RIMM（RAMBUS In-line Memory Modules，RAMBUS内嵌式内存模块）&ROM（read-only memory，只读存储器）&RRAM（Resistance RAM，非挥发性阻抗存储器）&RP（RAS Pre-charge Times，行地址预充电时间）&RL（Read Latency，读取反应时间）&SCP（CHIP SCALE PACKGE，芯片比例封装）&SD（Single Side，单面内存）&SDRAM（Synchronous Dynamic RAM，同步动态内存）&SDR（Single Date Rate，单数据率）&SDR SDRAM（Single Date Rate，单数据率SDRAM）&SGRAM（synchronous graphics RAM，同步图形随机储存器）&SIMM（Single Inline Memory Module，单边直线内存模块）&SLM（Spatial Light Modulator，空间光线调节器）&SM（Smart Media，智能存储卡）&SMRAM（System Management RAM，系统管理内存）&SODIMM（Small Outline Dual In-line Memory Modules，小型双重内嵌式内存模块）&SPD（Serial Presence Detect，串行存在检查）&SRAM（Static Random Access Memory，静态随机存储器）&SRAM（single-transistor DRAM，单晶体管DRAM）&SSFDC（Solid State Floppy Disk Card，固态软盘卡，通常指Smart Media）&SSTL（Stub Series Terminated Logic，残余连续终结逻辑电路）&TCP（Tape Carrier Packaging，带载封装）&TCSR（temperature compensated self refresh，温度补偿自刷新）&TD（Trace driven，追踪驱动）&TOM（Top of main memory，主内存顶端）&TSOPs（thin small outline packages，小型薄型封装）&UMA（Upper Memory Area，上部内存区）&ULVS（ultra low voltage signal，超低电压信号）&USWV（Uncacheable, Speculative, Write-Combining非缓冲随机混合写入）&VCRAM（Virtual Channel Memory，虚拟通道内存）&VCMA（Virtual Channel Memory architecture，虚拟通道内存结构）&VCSDRAM（Virtual Channel SDRAM，虚拟通道内存）&VM（Virtual Memory，虚拟存储器）&VR（Virtual Register，虚拟寄存器）&WBGA（Windows-BGA，WBGA的面积尺寸为传统TSOP封装的36.52%，重量为传统TSOP的23.37&%，整个WBGA的面积与内核的比例为128%，也就是说，封装的面积仅比管芯大28%。&WL（Write Latency，写反应时间）&WORM（write-once/read many，写一次读多次介质）&XDR（eXtreme Data Rate，极速数据率）&XMS（Extended Memory，扩展内存）&7、磁盘&AAT（Average access time，平均存取时间）&ABS（Auto Balance System，自动平衡系统）&AM（Acoustic Management，声音管理）&ASC（Advanced Size Check，高级尺寸检查）&ASMO（Advanced Storage Magneto-Optical，增强形光学存储器）&AST（Average Seek time，平均寻道时间）&ATA（Advanced Technology Attachment，高级技术附加装置）&ATOMM（Advanced super Thin-layer and high-Output Metal Media，增强形超薄高速金&属媒体）&BBS（BIOS Boot Specification，基本输入/输出系统启动规范）&BPI（Bit Per Inch，位/英寸）&bps（bit per second，位/秒）&bps（byte per second，字节/秒）&CAM（Common Access Model，公共存取模型）&CF（CompactFlash Card，紧凑型闪存卡）&CHS（Cylinders、Heads、Sectors，柱面、磁头、扇区）&CSS（Common Command Set，通用指令集）&DBI（dynamic bus inversion，动态总线倒置）&DIT（Disk Inspection Test，磁盘检查测试）&DMA（Direct Memory Access，直接内存存取）&DTR（Disk Transfer Rate，磁盘传输率）&EIDE（enhanced Integrated Drive Electronics，增强形电子集成驱动器）&eSATA（External Serial ATA，扩展型串行ATA）&FDB（fluid-dynamic bearings，动态轴承）&FAT（File Allocation Tables，文件分配表）&FC（Fibre Channel，光纤通道）&FDBM（Fluid dynamic bearing motors，液态轴承马达）&FDB（Fluid Dynamic Bearing，非固定动态轴承）&FDC（Floppy Disk Controller，软盘驱动器控制装置）&FDD（Floppy Disk Driver，软盘驱动器）&GMR（giant magnetoresistive，巨型磁阻）&HDA（Head Disk Assembly，头盘组件）&HiFD（high-capacity floppy disk，高容量软盘）&IDE（Integrated Drive Electronics，电子集成驱动器）&IPEAK SPT（Intel Performance Evaluation and Analysis Kit - Storage Performance&Toolkit，英特尔性能评估和分析套件 - 存储性能工具包）&JBOD（Just a Bunch Of Disks，磁盘连续捆束阵列）&LBA（Logical Block Addressing，逻辑块寻址）&MR（Magneto-resistive Heads，磁阻磁头）&MBR（Master Boot Record，主引导记录）&ms（Millisecond，毫秒）&MSR（Magnetically induced Super Resolution，磁感应超分辨率）&MTBF（Mean Time Before Failure，平均无故障时间）&NQC（Native Queuing Command，内部序列命令）&NTFS（Net Technology File System，新技术文件系统）&OTF（on-the-fly，高速数据传输错误纠正）&PCBA（Pring Circuit Board Assembly，印刷电路电路板组件）&PIO（Programmed Input Output，可编程输入输出模式）&PRML（Partial Response Maximum Likelihood，最大可能部分反应，用于提高磁盘读写传&输率）&RAID（Redundant Array of Independent Disks，独立磁盘冗余阵列）&RAID（Redundant Array of Inexpensive Disks ，廉价磁盘冗余阵列）&RPM（Rotation Per Minute，转/分）&RSD: Removable Storage Device（移动式存储设备）&RST（Read Service Times，读取服务时间）&SAMS（Seagate's Advanced Multi Drive System，希捷高级多硬盘系统）&SAS（Serial Attached SCSI，串行SCSI）&SATA（Serial ATA，串行ATA）&SBT（sound barrier technology，声音阻碍技术）&SCSI（Small Computer System Interface，小型计算机系统接口）&SCMA：SCSI Configured Auto Magically，SCSI自动配置&SLDRAM（Synchnonous Link DRAM，同步链路内存）&S.M.A.R.T.（Self-Monitoring, Analysis and Reporting Technology，自动监测、分析&和报告技术）&SPS（Shock Protection System，抗震保护系统）&SSO（simultaneously switching outputs，同时开关输出）&STA（SCSI Trade Association，SCSI同业公会）&STR（sequential transfer rates，连续内部数据传输率）&TCQ（tagged command queuing，标签命令序列）&TFI（Thin-Film Inducted Heads，薄膜感应磁头）&TPI （Track Per Inch，磁道/英寸）&Ultra CF（Ultra CompactFlash Card，超级紧凑型闪存卡）&Ultra DMA（Ultra Direct Memory Access，超高速直接内存存取）&LVD（Low Voltage Differential）&Wpcom（Write-Precompensation Cylinders，写电流补偿柱面数）&WST（Write Service Times，写入服务时间）&Seagate硬盘技术&AAM（Automatic Acoustic Management，自动机械声学管理）&CBDS（Continuous Background Defect Scanning，连续后台错误扫描）&DiscWizard（磁盘控制软件）&DST（Drive Self Test，磁盘自检程序）&SeaShield（防静电防撞击外壳）&8、光驱&ADIP（Address In Pre-Groove，预凹槽寻址）&ASPI（Advanced SCSI Programming Interface，高级SCSI可编程接口）&ATAPI（AT Attachment Packet Interface，AT扩展包接口）&BCF（Boot Catalog File，启动目录文件）&BURN-Proof（Buffer UnderRuN-Proof，防止缓冲区溢出，三洋的刻录保护技术）&BIF（Boot Image File，启动映像文件）&CAV（Constant Angular Velocity，恒定角速度）&CD（Compact Disc，紧密型光盘）&CDR（CD Recordable，可记录光盘）&CD-ROM/XA（CD－ROM eXtended Architecture，唯读光盘增强形架构）&CDRW（CD-Rewritable，可重复刻录光盘）&CLV（Constant Linear Velocity，恒定线速度）&DAE（digital Audio Extraction，数据音频抓取）&DAO（Disc At Once，整盘刻录）&DAO－RAW（Disc At Once Read after Write，整盘刻录－写后读）&DDSS（Double Dynamic Suspension System，双悬浮动态减震系统）&DDSS II（Double Dynamic Suspension System II，第二代双层动力悬吊系统）&DSD（Direct Stream Digital，直接比特流数码）&DVD（Digital Video/Versatile Disk，数字视频/万能光盘）&DVD-R（DVD Recordable，可记录DVD盘）&DVD-RW（DVD Rewritable，可重复刻录DVD盘）&DVD-RAM（Digital Video/Versatile Disk - Random Access Memory，随机存储数字视频&/万能光盘）&DWDD（Domain Wall Displacement Detection，磁畴壁移动检测）&ESER（EAC Secure Extract Ripping，EAC安全抓取复制）&GM（Glass Mould，玻璃铸制）&GSM（Galvanization Superconductive Material，电镀锌超导材料）&IPW（Incremental Packet Writing，增量包刻录）&LIMDOW（Light Intensity Modulation Direct OverWrite，光学调制直接覆盖）&LD（Laser Disc，激光视盘，大碟）&LG（Land Groove，岸地凹槽）&MAMMOS（magnetic amplifying magneto-optical system，磁畴放大播放系统）&MD（MiniDisc，微型光盘）&ML（multi-level，多层光盘技术）&MO（Magneto Optical，磁光盘）&OTF（On The Fly，飞速刻录）&OWSC（Optimum Write Speed Control、优化写入速度控制）&PCAV（Part Constant Angular Velocity，部分恒定角速度）&PPLS（Pure Phase Laser System，纯相位激光系统）&RS-PC（Reed-Solomon Product Code，里德所罗门编码）&RLL（Run Length limited，运行长度限制码）&SACD（Super Audio CD，超级音频CD）&SAO（Sessino At Once，区段刻录）&SARC（Super－Advanced Rapid Cooling，超高级快速冷却）&SC（Spin Coat，旋转覆盖）&SCM（Spin Coat Method，旋压覆盖法）&SLL（SeamLess Link，无缝连接）&SMT（Superconductive Microtherm Technology，超导体散热材料）&Super RENS（super resolution near-field structure，超精细近场结构）&TAO（Track At Once，轨道刻录）&TBW（Thermo Balanced Writing，热电平衡写入）&VCD（Video COMPACT DISC，视频CD）&VIPC（Intelligent Variable Power Correct，智能变功纠错技术）&WD（Working Distance，工作距离）&特殊技术&SOS（Smart Object Salvation，智能目标分析拯救系统）&TADS（Target Acquisition and Designantion For DVD，DVD目标获取和指定）&9、打印机&AAS（Automatic Area Seagment?）&dpi（dot per inch，每英寸的打印像素）&ECP（Extended Capabilities Port，延长能力端口）&EPP（Enhanced Parallel Port，增强形平行接口）&IPP（Internet Printing Protocol，因特网打印协议）&MPT（Micro Piezo Technology，微针点压电）&ppm（paper per minute，页/分）&SPP（Standard Parallel Port，标准并行口）&TA（Thermo Autochrome，全彩色感热式热感打印）&TB（Thermal Bubble，热泡式）&TET（Text Enhanced Technology，文本增强技术）&USBDCDPD（Universal Serial Bus Device Class Definition for Printing Devices，打&印设备的通用串行总线级标准）&VD（Variable Dot，变点式列印）&10、扫描仪&CIS（Contact Image Sensors，接触图像传感器）&TWAIN（Toolkit Without An Interesting Name，无注名工具包协议）&11、公司名称&3Nod（三诺）&10MOONS（天敏）&A4tech（双飞燕）&ABIT（升技)&Acer（宏基）（笔记本以及品牌电脑使用的牌子）&Accolade（崇盛）&Acorp（佰钰）&ACTIMA（长谷）&AD（Analog Device Inc，类比设备公司）&Addonics（花王）&ADI（诚洲）&AGFA（爱克发）&Airwebs（联尚）&Aiwa（爱华）&AL（Advanced Logic Inc，先进逻辑公司）&Albatron（青云）&AMAZON（亚马逊）&Amax（中宇）&AMC（Applied Microsystems, Corp，实用微系统公司）&AMD（Advanced Micro Device，超微半导体）&AMI（American Megatrends Incorporated，美国趋势科技）&AOC（冠捷）&AOPen（Acer Open，建碁）&Apacer（宇瞻）&APC（American Power Conversion，美国能源转换）&Apple（苹果）&APT（中达国际）&ArtMedia（亚美达)&ASF（Applied Science Fiction）&Asion（亚逊）&ASUS（华硕）&ATi（治天，扬智）&Asource（源兴）&Atrend（中凌）&AVC（Asian Vital Components，奇鈜科技，亚洲关键部件生产商）&Award（爱华）&Aztech（爱捷特）&Bell（贝尔）&Benq（Bring Enjoyment and Quality to Life，明基，传达资讯生活真善美）&BETOP（北通）&Bigata（百佳泰）&BIGHAND（大手）&BioStar（映泰）&BOE（Beijing Over East，京东方）&Brother（兄弟）&BTC（英群）&BUDDY（霸迪）&C&T（Chips and Technologies, Inc. 芯片和技术公司）&Canon（佳能）&Casio（卡西欧）&Cardex（耕宇）&Cellink（浩年）&Chaintech（承启）&Chaoyi-tech（超意数码）&Chic（业盛）&China（Sciences Group 中科&Cisco（思科）&CL（Cirrus Logic)&CMedia（骅讯）&color（七彩虹）&Creative（创新）&Creative（Idea（创新锐）&Compaq（康柏）&CSUN（世讯)&CTX（中强）&CVICSE（中创）&DataExpert（联讯）&Dataland（迪兰恒进）&Daywoo（大宇）&DDD（三帝，秦众QinZhong）&DDD（Dynamic Digital Depth Inc.，动态数字境深公司，&DEC（Digital Equipment Corp. 数据设备公司）&DELL（戴尔）&delta（台达）&DESHARK（帝鲨）&DFI（友通，钻石）&Diamond（帝盟）&DGC（大吉）&Diamond（帝盟）&DTI（Dimension Technologies Inc，维度技术公司）&DTK（创宏）&EAR（Extreme Audio Reality）&Ecom（龙维）&ECS（精英）&Eagles（金鹰）&EagleTec（鹰泰）&EMC（唯冠，华冠）&EPO（仪宝）&EPOX（磐英 现正更名为&磐正&）&Epson（爱普生）&Ericsson（爱立信）&Etech（力宜）&ETOP（顶坚）&FIC（First International Computer,Inc.第一国际计算机公司）大众&FLY（福扬）&FMI（Fujitsu Microelectronics, Inc.）富士通微电子&Founder（北大方正）&Freetech（富棋）&FST（Future Sound Technologies）未来音乐技术&Fujistu（富士通）&FujiFilm（富士林）&Gadmei（佳的美）&Gainward（耕宇）&Gamtec（和跃）&Geil（Gold Empire International Ltd，金皇国际有限公司）&Genius（胜盈）&Genuine（捷元）&Gigabyte（技嘉）&GoldSun（高圣）&Gigabyte（技嘉）&GreatWall（长城）&Guillemot&Hercules（大力神）&GVC（致福）&Haier（海尔）&Hanwang（汉王）&Hardlink（固网）&Hayes（贺氏）&Hedy（七喜）&High-Edge（高尖）&HighPower（海霸）&Hitachi（日立）&Hoxtek（富本）&HP（Hewlett-Packard，美国惠普公司）&HP-Link（和平）&HuaWei（华为）&Huaqi（华旗）&Hyundai（现代）&IBM (International Business Machine Corp.，国际商业机器）&IDG（International Data Group，国际数据集团）&IDT（Integrated Device Technology, Inc. 综合设备技术公司）&ICS（Integrated Circuit Systems，集成电路系统）&IIYAMA（饭山）&Imagic（梦想家）&Intel（英特尔）&Iwill（艾崴）&IMS: International Meta System&Infineon（亿恒，英飞凌）&Iomega（艾美加）&ITE（Integrated Technology Express, Inc. 综合技术加速公司）&JetBoard（捷波）&Jetway（捷锐）&Jhncc（华鑫）&JNC（捷讯）&Joytech（阿波罗）&K&G（将王）&Kinpo（联宝）&Kingfore（金佛）&Kinghorse（）&Kingmax（胜创）&KingNet（金浪）&Kingstone（金仕顿）&Kodak（柯达）&lander（建达蓝德）&LangChao（浪潮）&Leaktek（丽台）&Legend（联想）&LEMEL（联强）&LEO（大众）&Lexmark（利盟）&LG（乐金）（Goldstar，高士达）&Liteon（建兴）&Longway（龙维）&Lucent（朗讯）&LuckyStar（联胜）&MagicPro（辉煌）&MAG（美格）&MANLI（万丽）&Matsonic（松力）&Maxtor（迈拓）&Maxell（万胜）&Maxtor（迈拓）&MediaTek（联发）&Megastar（皇朝）&Megtron（美创）&Microsoft（微软）&Micron（美光，美凯龙）&Microtek（全友（台湾中晶））&Mida（美达）&Minolta（美能达）&Mitsubshi（三菱）&Mitsumi（美上美）&MLE：Microsoft Learning and Entertainment，微软教学与娱乐公司&MoSyS（Monolithic System Technology, Inc.，单片电路系统技术公司）&Motorola（摩托罗拉）&MS（Microsoft，微软）&MSI（MicroStar，微星）&Mustek（台湾鼎展科技）&Nanya（南亚）&NAI: Network Associates Incorporation，前身为McAfee。&National（松下）&NDL（Numerical Design Limited，数字设计有限公司）&NEC（日电）&NETAC（朗科）&Nightingale（夜莺）&Nikon（尼康）&Nissan（日产）&NMC（New Media Communication，新型媒体通信）&NOKIA（诺基亚）&Norcent（宏盛）&NS（National Semiconductor，国家半导体）&NTC（Nanya Technology Corp. ，南亚科技）&NTT（nippon telegraph and telephone，日本电报和电话公司）&NumberNine（第9）&OAK（海洋）&Octek（海洋）&Olympas（奥林巴斯）&OMEGA（奥米加）&Ondata（昂达)&Origo（欧瑞格）&Palit（小精灵）&Panasonic（松下）&Paradise（奔驰/新天下）&pcchips（明致/鑫明）&PenPower（蒙恬）&Penrod（彭路得）&Permier（普立尔）&Philips Semiconductors（飞利普半导体）&Pilotide（旗舰）&Pine（松景）&Pioneer（先锋）&PMI: Pacific Magtron International&PowerColor（憾讯）&PROCOMP（博达）&QDI（Quality Delivery Innovation，品质递送创新，联想）&QDI（Quantum Design Incorporation，量子设计公司）&Quanta（广达）&Quantum（昆腾）&Quantum3D（昆腾3D）&Qxcomm（全向）&RCC（Reliance Computer Corporation，信心计算机公司，ServerWorks的前身）&Realtek（瑞昱）&Redfox（红狐)&Ricoh（理光）&Rongfeng（融丰）&RPE（Royal Philips Electronics，皇家飞利浦电子公司）&Samaung（三星）&Sanyo（三洋）&SAST（先科）&SBELL（上海贝尔）&SCE（sony computer entertainment，索尼计算机娱乐部）&Seagate（希捷）&Seagull（海鸥）&SeeThru（世和资讯）&SGI（Silicon Graphics Inc，硅图形公司）&SMC（Standard Microsystems Corp. 标准微系统公司）&SMIC（Semiconductor Manufacturing International Corporation，中芯国际集成电路制&造有限公司）&Shuttle（浩鑫）&Siemens（西门子）&SIPIX（矽峰）&SiS（Silicon Integrated Systems，硅片综合系统公司，矽统）&Soltek（硕泰克）&Sony（索尼）&Soyo（梅捷）&Sparkle（旌宇）&Speedy（讯怡）&Start（Star，实达）&STM（STMicroelectronics，意法半导体，由意大利SGS Microelettronica及法国Thomsom&半导体公司合并而成）&Stones（四通利方）&Sun Microsystems（升阳/太阳微系统）&SuperMicro（超微）&Superpower（上普）&Taicom（台康）&Teac（泰克）&Teclast（台电）&Tekram（建邦）&TENDA（吉顺通）&Thunis（清华紫光）&TI（Texas Instruments Inc. 德州仪器）&Titan（提坦）&Togotech（岛谷科技）&Tontru（同创）&TopStar（国傲通，顶星）&TORiSAN（三井）&Toshiba（东芝）&TP-link（普瑞尔）&Transmeta（全美达）&Trident（泰鼑）&Triplex（启亨）&TSMC（Taiwanese Semiconductor Manufacturing Company，台湾积体电路）&TW（同维）&TwinMOS（勤茂）&Transcend（创建、宇瞻）&Twinhead（伦飞）&Tyan（泰安）&UEI（Universal Electronics Inc.，世界电器）&Umax（力捷）&UMC（United Microelectronics Corporation，台湾联华电子公司，半导体制造商）&Uniark（天虹）&Unika（双敏）&USI（Universal Scientific Industrial，通用科学工业）&USTC（Union Semiconductor Technology Corp，联合半导体技术公司）&V^3（V Cubed Semiconductor，V立方半导体）&VIA（威盛）&ViewSonic（优派国际）&Viguar（伟格）&VuegoBrisa（明基电通）&WD（Western Digital，西部数据）&Winbond（华邦）&Wintime（富品）&Winward（）&Xerox（施乐）&XGI（Xabre Graphic Inc，前图强，SiS的独立的图形芯片业务部门）&Xoceco（厦华）&Yamaha（雅马哈）&Yuan（小影霸）&ZD（Ziff-Davis出版公司）&Zeling（则灵）&Zida（华基）&Zoltrix（速捷时）&12、组织和会议&ADT（Advanced DRAM Technology，高级内存技术）&ANSI（American National Standards Institute，美国国立标准协会）&BAD（Best Amiga Dominators）&CBF: Cable Broadband Forum，电缆宽带论坛&CEA（Consumer Electronics Association，消费者电子协会）&CEMA（Consumer Electronics Manufacturing Association（消费者电子制造业协会）&CPE: Customer Premise Equipment（用户预定设备）&CSA（Canadian Standards Association，加拿大标准协会）&DCA: Defense Communication Agency，国防部通信局&DOJ: Department of Justice（反不正当竞争部门）&DSP: Delivery Service Partner（交付服务合伙人）&DVB：Digital Video Broadcasting，数字视频广播&E3（Electronic Entertainment Expo，电子娱乐展览会）&EFF: Electronic Frontier Foundation（电子前线基金会）&EPA（Environmental Pr&圆桌是公平的象征&[删除本条回复并通知作者] 文章点击发送消息给对方 宝物：后悔药 状元令&楼层： 第 2 楼 时间： 23:11:08&作者： 大圆桌&修武校尉(正九品)&[硬件改造]版主&12、组织和会议&ADT（Advanced DRAM Technology，高级内存技术）&ANSI（American National Standards Institute，美国国立标准协会）&BAD（Best Amiga Dominators）&CBF: Cable Broadband Forum，电缆宽带论坛&CEA（Consumer Electronics Association，消费者电子协会）&CEMA（Consumer Electronics Manufacturing Association（消费者电子制造业协会）&CPE: Customer Premise Equipment（用户预定设备）&CSA（Canadian Standards Association，加拿大标准协会）&DCA: Defense Communication Agency，国防部通信局&DOJ: Department of Justice（反不正当竞争部门）&DSP: Delivery Service Partner（交付服务合伙人）&DVB：Digital Video Broadcasting，数字视频广播&E3（Electronic Entertainment Expo，电子娱乐展览会）&EFF: Electronic Frontier Foundation（电子前线基金会）&EPA（Environmental Protection Agency，美国环境保护局）&ETRI（Electronics and Telecommunications Research Institute，电子和电信研究协会&）&FCC（Federal Communications Commission，联邦通信委员会）&FTC（Federal Trade Commission，联邦商业委员会）&GDC（Game Developer Conference，游戏发展商会议）&HTTC（HyperTransport Technology Consortium，HyperTransport技术协会）&ICT（Information and Communications Technology，信息和通讯技术）&IEC（International Electrotechnical Commission，国际电子技术委员会）&ISSCC（International Solid-State Circuits Conference，国际晶体管电路讨论会）&ICSA: International Computer Security Association（国际计算机安全协会）,它的前&身为NCSA（National Computer&Security Association,国家计算机安全协会）&ITU（International Telecommunications Union，国际电信同盟）&IEEE（Institute of Electrical and Electronics Engineers，电子电路工程师协会）&IETF（Internet Engineering Task Force，因特网工程任务组）&IFWP: International Forum White Paper，国际白皮书论坛&ISC（International Steering Committee，国际筹划指导委员会）&ISO/MPEG: International Standard Organization's Moving Picture Expert Group（国&际标准化组织的活动图片专家组）&ISOM（International Symposium on Optical Memory，光盘国际会议）&ISSCC（IEEE International Solid-State Circuits Conference，IEEE国际固态电路协议&）&ITAA: Information Technology Association of American，美国信息技术协会&ITWG（international technology working groups，国际技术工作组）&JCIA（Japan Camera Industry Association，日本摄影机工业协会）&JEDEC（Joint Electronic Device Engineering Council，联合电子设备工程委员会）&JEITA（Japan Electronic Information Technology Association，日本电子信息技术产&业协会）&JPEG（Joint Photographic Experts Group，联合图像专家组开发的一种图像压缩格式）&MAC（Mobile Advisory Council